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Physical Dimensions
BALL A1
INDEX AREA
E
A
F
B
1.20
1.20
2X
0.03 C
?0.20
Cu Pad
A1
A1
?0.215
Cu Pad
D
2X
0.03 C
?0.30 Solder
Mask Opening
0.40
option 1
1.60
0.40
0.40
option 2
?0.315 Solder
Mask Opening
TOP VIEW
0.06 C
RECOMMENDED LAND PATTERN
(NSMD TYPE)
0.05 C
C
D
0.625
0.547
SEATING PLANE
E
SIDE VIEWS
0.378±0.018
0.208±0.021
NOTES:
0.40
1.20
E
D
0.005
?0.260±0.02
20X
C A B
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
1.60
C
D. DATUM C IS DEFINED BY THE SPHERICAL
0.40
1 2 3 4
B (Y) ±0.018
A
(X) ±0.018
F
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
BOTTOM VIEW
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC020AArev3.
Figure 31 20-Ball, WLCSP, 4x5 Array, 0.4 mm Pitch, 250 μm Ball
Product-Specific Dimensions
Product
FAN53540UCX
D
1.96 +0.030
E
1.56 +0.030
X
0.180
Y
0.180
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC020AA.pdf .
? 2011 Fairchild Semiconductor Corporation
FAN53540 ? Rev. 1.0.3
14
www.fairchildsemi.com
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